APAC Innovation Summit 2015 Series – Robotics

Jun 24-25, 2015

With an aim to connect all stakeholders, facilitate collaboration and catalyse new ideas and opportunities, APAC Innovation Summit, the flagship event of Hong Kong Science and Technology Parks Corporation, adopts a thematic approach covering 5 major technology areas with a series of events spreading over Year 2015-2016. The "Robotics" series in June gathered a panel of world-renowned experts to share on the robotics technology trend and its applications in homecare, edutainment, industrial automation and medical field. The 2-day event also featured a mini-exhibition to showcase the latest innovations from academia, research community and industry.

Date: 24 - 25 June 2015
Time: 09:30 – 17:30
Venue: Grand Hall, Hong Kong Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Website: http://www.apacinnosummit.net/ 

HKBIO members were offered 50% discount of listed ticket price on AIS Series.

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